英语翻译PLATING:SPRING CONTACT PLATING TO BE TESTED ON A LOT BAS
来源:学生作业帮 编辑:作业帮 分类:化学作业 时间:2024/09/29 21:11:11
英语翻译
PLATING:SPRING CONTACT PLATING TO BE TESTED ON A LOT BASIS PER 069-7497
BLOCKER:NO BLOCKER ALLOWED
UNDER PLATING:1.2 UM NICKEL MINIMUM,ALL OVER
OVER PLATING:0.8 UM GOLD MINIMUM,ON END OF SPRING CONTACT
OVER PLATING:3-5 UM TIN,LOCAL TO PAD
CONTACT RESISTANCE:0.10 OHMS MAX
PLATING:SPRING CONTACT PLATING TO BE TESTED ON A LOT BASIS PER 069-7497
BLOCKER:NO BLOCKER ALLOWED
UNDER PLATING:1.2 UM NICKEL MINIMUM,ALL OVER
OVER PLATING:0.8 UM GOLD MINIMUM,ON END OF SPRING CONTACT
OVER PLATING:3-5 UM TIN,LOCAL TO PAD
CONTACT RESISTANCE:0.10 OHMS MAX
PLATING:SPRING CONTACT PLATING TO BE TESTED ON A LOT BASIS PER 069-7497
电镀:根据069-7497对弹簧接触镀层进行基本测试.
BLOCKER:NO BLOCKER ALLOWED
挡块:不允许有挡块
UNDER PLATING:1.2 UM NICKEL MINIMUM,ALL OVER
底层电镀:最小镀镍厚度1.2微米,全镀
OVER PLATING:0.8 UM GOLD MINIMUM,ON END OF SPRING CONTACT
外层电镀:在弹簧接触端,最小镀金厚度0.8微米.
OVER PLATING:3-5 UM TIN,LOCAL TO PAD
外层电镀:垫板局部,镀锡厚度3-5微米
CONTACT RESISTANCE:0.10 OHMS MAX
接触电阻:最大0.10欧姆
电镀:根据069-7497对弹簧接触镀层进行基本测试.
BLOCKER:NO BLOCKER ALLOWED
挡块:不允许有挡块
UNDER PLATING:1.2 UM NICKEL MINIMUM,ALL OVER
底层电镀:最小镀镍厚度1.2微米,全镀
OVER PLATING:0.8 UM GOLD MINIMUM,ON END OF SPRING CONTACT
外层电镀:在弹簧接触端,最小镀金厚度0.8微米.
OVER PLATING:3-5 UM TIN,LOCAL TO PAD
外层电镀:垫板局部,镀锡厚度3-5微米
CONTACT RESISTANCE:0.10 OHMS MAX
接触电阻:最大0.10欧姆
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